Subsequent yr’s iPhone 18 will use TSMC’s next-generation 2-nanometer fabrication course of together with a sophisticated new packaging technique, and the world’s main pure-play foundry has reportedly already established a devoted manufacturing line for Apple in anticipation of mass manufacturing in 2026.
In response to previous reports, Apple’s A20 chip in iPhone 18 fashions will change from the earlier InFo (Built-in Fan-Out) packaging to WMCM (Wafer-Stage Multi-Chip Module) packaging. Technically, the variations between the 2 packaging strategies are fairly hanging.
InFo permits integration of elements, together with reminiscence, throughout the package deal however focuses extra on single-die packaging the place reminiscence is usually hooked up to the principle SoC (comparable to DRAM positioned on high or close to the CPU and GPU cores). It is optimized for decreasing the dimensions and bettering the efficiency of particular person chips.
WMCM, however, excels at integrating a number of chips throughout the identical package deal (therefore the “Multi-Chip Module” half). This technique permits extra advanced programs, comparable to CPUs, GPUs, DRAM, and different customized accelerators (e.g., AI/ML chips) to be tightly built-in in a single package deal. It offers better flexibility in arranging various kinds of chips, stacking them vertically or inserting them aspect by aspect, whereas additionally optimizing communication between them.
TSMC plans to begin manufacturing 2nm chips in late 2025, and Apple is anticipated to be the primary firm to obtain chips constructed on the brand new course of. TSMC typically builds new fabs when it wants to extend manufacturing capability to deal with important orders for chips, and TSMC is increasing in a serious method for 2nm know-how.
To serve its main consumer Apple, TSMC has established a devoted manufacturing line at its Chiayi P1 fab, the place WMCM packaging month-to-month capability is anticipated to achieve 10,000 items by 2026, experiences DigiTimes. In response to Apple analyst Ming-Chi Kuo, solely “Professional” fashions within the iPhone 18 sequence are seemingly to make use of TSMC’s next-generation 2nm processor know-how due to cost concerns. Kuo additionally believes that the iPhone 17 Professional will characteristic 12GB of RAM because of the brand new packaging technique.
Phrases like “3nm” and “2nm” describe generations of chip manufacturing know-how, every with its personal set of design guidelines and structure. As these numbers lower, they typically point out smaller transistor sizes. Smaller transistors permit extra to be packed onto a single chip, sometimes leading to elevated processing velocity and improved energy effectivity.
Final yr’s iPhone 16 sequence is predicated on an A18 chip design constructed utilizing a second-generation “N3E” 3nm course of. In the meantime, this yr’s upcoming iPhone 17 lineup is anticipated to make use of A19 chip know-how that is seemingly constructed on an upgraded 3-nanometer course of referred to as “N3P.” In comparison with earlier variations of 3nm chips, the N3P chips provide elevated efficiency effectivity and elevated transistor density.